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| | | | Hello and a good day.
It has been a busy start to the New Year here at Meyer Burger. Together with our research partner, CEA INES in France, we achieved a record 24% performance with our Heterojunction cells; our MAiA 6.1 passed its final acceptance test on customer site and our PiXDRO inkjet system won the IPC APEX Expo Innovation Award. We invite you to read on and learn more about our newest products and product updates as well as our strategic 600 MW Heterojunction / SmartWire contract.
We would also like to take this opportunity wish all of our Chinese customers, partners and suppliers a joyous New Year's celebration together with their families.
Meyer Burger continues to drive the PV technology roadmap, we want to enable you, our customers, to achieve your lowest cost of production while setting your highest records in efficiency.
Michael Escher
CCO | | | | |
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| | | | | | Superior Cells
CEA/INES in partnership with Meyer Burger, has realized a new power record with HJT cells. This further underscores the superiority of heterojunction cells. [more] |
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| | | Smart Contacts
Module manufacturers around the world are increasingly choosing SmartWire Connection Technology SWCTTM.
[more] |
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| | | | HELiAPECVD
Best Passivation Quality – No Cross Contamination | |
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| | | | With the HELiA PECVD deposition system, Meyer Burger offers the most advanced coating system for a-Si layers of Heterojunction Technology cells. The innovative system avoids cross contamination of intrinsic passivation layers at p/n interface and contamination inside the process chambers due to the S-Cube box-in-box design. | | | | |
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| | | | Milestone:
Large-scale contract for 600 MW HJT/SWCTTM core equipment | |
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| | | | | | | | Meyer Burger has signed a major strategic contract for Heterojunction (HJT) and SmartWire Connection Technology (SWCT™). A leading solar manufacturer has ordered core equipment for a 600 MW Heterojunction and SWCT™ integrated production line. The start of cell and module production is planned for the second half of 2019.
SmartWire cell connection technology (SWCT™) maximizes the energy yield of HJT solar modules |
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| and is the perfect combination for an industrialized, highly efficient PV mass production line. The total manufacturing capacity is scheduled to be in full production by the first quarter of 2020.
[Read the complete press release] | |
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| | | | | | | | | IPC APEX Expo Innovation Award
Meyer Burger will be honored for a novel inkjet-printed solder mask solution for PCB, combining a dedicated production inkjet printing system based on PiXDRO product line, Agfa's unique DiPaMat solder mask ink, and advanced printing strategies for optimized layer deposition across a PCB.
[Learn more] |
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| | | | | | | | | | Successful Final Acceptance for MAiA 6.1 |
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Our latest MAiA system MAiA 6.1 passed the first final acceptance at customer's site successfully. The system works reliably since December 2018 with minimum 6,300 wafers/hour and provides best layer quality.
[Learn more about MAiA] |
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| | | | Further advantages of the MAiA 6.1 compared to previous generations and the competition:- Lowest breakage rate ever (less handling steps)
- Lowest OPEX ($/wafer)
- Best footprint utilization
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Meyer Burger is renowned for its diamond wire (DW) wafering and slicing expertise; playing a leading role in the adoption of diamond wire in different industries. With its in-depth understanding of the DW slicing process, Meyer Burger's developed its state-of-the-art DW 288 S6 machine. Beyond the advanced electrical and mechanical system design, the software has been further developed for maximum process control and usability in modern manufacturing environments. |
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| | | | The DW 288 S6 multi-wire saw is designed for slicing hard and brittle materials at highest precision and throughput. It is based on the widely adopted and successful DW288 product family and has been optimized for 6" workpieces with loads of up to 650mm of material. The latest generation "workpiece" rocking technology combined with the adaptive feed ensures best wafer quality, maximum throughput and lowest cost of ownership.
Whether slicing sapphire, silicon, ceramics, quartz, magnetic or other hard and brittle materials, the DW 288 S6 offers clear advantages in productivity, robustness and quality.
The DW 288 S6 offers a best-in-class workpiece rocking concept for outstanding results. It enables higher accessibility and is user friendly. With its monitoring and logging capabilities, the equipment is ready for Industry 4.0.
More information on this vanguard equipment will be released in the next newsletter edition | |
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| | | | | | | | 29.-31.01.2019
IPC APEX Expo
San Diego |
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| | | | | 05.-07.02. 2019
SPIE Photonics West
San Francisco, USA
The Moscone Center, Booth 4545 |
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| | | | | | | | 18.-21.02.2019
FLEX
Monterey, USA
Hyatt Regency, Booth 4006 |
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| | | | | 20.-22.03. 2019
SEMICON China
Shanghai, China
New International Expo Centre
Hall N2, Booth 2671 |
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| | | | | | | | 20.-21.03.2019
LOPEC
Munich, Germany
Messe München
Hall B0, Booth 303 |
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| | | | | 30.04.-01.05. 2019
SVC TechCon
Long Beach, USA
Convention Center, Booth 117 |
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| Imprint:
Meyer Burger (Germany)
An der Baumschule 6-8
09337 Hohenstein-Ernstthal
Represented by: Michael Escher
Click here for privacy policy. |
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