| | Dear Armando Guglielmetti, |
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2025 was a pivotal year for ams OSRAM – and for the value we can create for you. Despite a challenging market environment, we made strong operational and financial progress. Our core semiconductor business continued to grow. We captured the global number one position in packaged LED. And we achieved a new all-time high in design-wins, strengthening the innovation pipeline that benefits future applications.
Our future lies in digital photonics. With the sale of our non-optical sensor business to Infineon, we are sharpening our strategic focus on optical semiconductor technologies. This allows us to concentrate our resources on the digitalization of light – enabling applications from intelligent automotive lighting and sensing to smart glasses, biosensing, robotics and AI data-center interconnects.
With the industry’s broadest portfolio of advanced light emitters, optical sensors, and driver/IC technologies, we are committed to supporting your success with reliable, cutting-edge products.
We are moving forward with determination – to sense the power of light together with you.
Yours,
Aldo Kamper
CEO ams OSRAM |
| Why the next generation of smartphones will rely on spectral sensing
Even premium smartphones battle to keep colors natural and text readable as lighting changes. Traditional ambient light sensors only measure brightness – leaving displays looking too cool indoors, washed out in sunlight, or harsh at night. Spectral sensors change that. By capturing the full light spectrum, they understand color temperature and ambient tint far more precisely. This allows the display to adjust white point and brightness in real time, so content always looks authentic and comfortable. From warm indoor light to bright outdoor conditions, spectral sensing ensures a natural, consistent viewing experience – one that feels right without users noticing the technology behind it. Read now on LinkedIn.
Want to go deeper? How spectral sensing boosts color consistency in smartphone cameras is explained in our latest expert blog on spectral sensing for automatic white balance. Sebastian Requena Witzig shows how multi‑channel color sensors identify the light source, correct the white point, and deliver glass‑to‑glass color consistency from camera to display – even for the most demanding smartphone applications. Read now. |
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Augmented & virtual reality |
Mira016 – enabling precise eye tracking in AR/VR
The Mira016 global shutter image sensor delivers highly accurate and reliable eye tracking for next generation AR/VR devices. Its NIR enhanced 0.16 MP resolution, fast 360 fps capture, and compact 1.8 × 1.8 mm package ensure precise pupil and glint detection even during rapid movement. With excellent NIR sensitivity, low power performance, and integrated on chip processing, Mira016 is ideal for immersive wearables and compact 3D sensing systems. |
| Chip LED SFH 4043B & SFH 4053B – advancing IR:6 performance
The new SFH 4043B and SFH 4053B bring our latest IR:6 thin-film chip technology to low power IR illumination. These compact emitters deliver up to 50% higher radiant intensity for precise eye tracking, while boosting efficiency by up to 63% for longer battery life and optimized device performance. Ideal for AR/VR glasses, iris recognition, biometric systems and advanced optical scanning, they set new benchmarks in compact, high performance IR lighting. |
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Automotive lighting and sensing |
SYNIOS™ P2222 – more flexibility for automotive body lighting
The SYNIOS™ P2222 portfolio now expands with low power red, super red, and yellow options, giving designers more freedom to create slim, efficient, and visually striking car body illumination. These LEDs combine high efficiency with robust performance in a compact footprint, making them ideal for next generation signaling applications. With tailored color variants and consistent optical behavior, SYNIOS™ P2222 delivers the versatility needed to build distinctive, energy optimized lighting signatures. |
| AS5173 – precision sensing for advanced chassis control
The AS5173 is a low noise, strayfield immune magnetic angle position sensor designed for highly accurate chassis and motion control. With its robust PSI5 output and immunity to harsh electromagnetic environments, it ensures stable performance in active damping, steering angle detection, and pedal position measurements. Engineered for modern automotive and EV environments, the AS5173 delivers reliable precision that helps manufacturers enhance driving dynamics, safety, and system responsiveness. |
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| OSP – moving toward global ISO standardization
The Open System Protocol (OSP) from ams OSRAM has officially entered the ISO standardization process, marking a key step toward broad industry adoption. With ISO TC22 launching the work item under ISO 263411, OSP addresses the rising need for open, interoperable communication in softwaredefined vehicles. Already in series production and enabling intelligent lighting and smart endpoints, OSP strengthens its position as a licensefree, futureproof protocol now being integrated by leading ecosystem partners.
Read more. |
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AS5966 CT sensor – high resolution imaging in a compact design
The AS5966 CT sensor brings high‑end CT performance into a compact, four‑side‑buttable design. By integrating a photodiode array and ADC on a single CMOS chip and leveraging advanced TSV technology, it unlocks scalable detector coverage from 2 cm to 16 cm. The result: excellent signal‑to‑noise performance, ultra‑low power consumption, and streamlined assembly for sharper images and a wider field of view – ideal for next‑generation health and imaging devices. |
| AS6223 Evaluation Kit – fast, simple temperature sensing demo
The new AS6223 evaluation kit makes it easy to explore the performance of our compact, low power digital temperature sensor. The kit includes the AS6223 temperature button and a CR2023 coin cell – just pull the flap, pair it with the mobile app, and start measuring within minutes. A short demonstration video guides users through setup and highlights real-time accuracy, enabling quick, hands-on evaluation for wearable, medical, and IoT applications. |
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TSV technology – unlocking smarter, more compact sensor designs
Through Silicon Via (TSV) technology enables highly integrated, electrically robust sensor architectures by routing signals vertically through the silicon. This shortens interconnect paths, reduces parasitic effects, and improves signal integrity – supporting smaller, low noise devices with greater design flexibility. TSV also enhances optical integration and mechanical stability, making it ideal for next generation sensing solutions across demanding environments. Discover how TSV drives innovation in advanced optical and sensor designs.
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| Full-Service Foundry MPW speeds analog mixed-signal prototyping
Do you need an experienced and reliable manufacturing and a Europe-based supply-chain partner to make a rapid design start for your high-performance IC prototypes? The ams OSRAM 2026 Multi-Project Wafer (MPW) program introduces new 180nm mixed-signal CMOS and Bipolar-CMOS-DMOS (BCD) technology platforms. This expansion delivers cost-efficient prototyping for engineers across established companies, startups, and research institutions. Discover how these new capabilities support power management, motor control, and sensor applications.
Reserve your place on the 2026 schedule, or contact the foundry team today to get started. |
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| Optical force sensing – transforming next generation control interfaces
Optical force sensing (OFS) from ams OSRAM enables multimodal, reliable, and hygienic controls in modern electronic devices. By detecting surface deformation with high precision, OFS supports soft, medium, and hard presses while integrating seamlessly into flat, space saving designs. Combined with IR transparent surfaces, OFS also enables touch and proximity functions – unlocking stylish, context sensitive interfaces without adding design complexity.
Read more. |
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| Meet us at Light + Building 2026 in Frankfurt
ams OSRAM invites you to Light + Building 2026 in Frankfurt from March 8–13, where we will showcase how intelligent light and sensing technologies are shaping electrified environments. Experience how our LEDs, sensors, and ICs bring energy, intelligence, and emotion to connected spaces. Visit us in Hall 8.0, Booth D40 to discover our latest demonstrations.
Read more. |
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| Meet us at AKL Aachen – shaping tomorrow with laser innovation
Join us from April 22–24 at AKL Aachen to explore our European built laser excellence. Discover how our semiconductor based laser diode technologies drive next generation solutions across industry, mobility, consumer, medical, and automotive markets. With high efficiency, reliability, and a broad application focused portfolio, we help partners innovate faster and scale confidently.
Read more. |
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This was MWC 2026 – sensing the power of light
At MWC 2026 in Barcelona, ams OSRAM showcased advanced optical sensing and illumination technologies for mobile devices, smart glasses, and wearables. Highlights included ambient light, spectral and flicker sensing, direct time of flight for autofocus and 3D depth, optical force touch, and ultra compact sensors for vision and health. Let us connect and sense the power of light together.
Read more. |
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DVN Munich
We enjoyed great insights and inspiring conversations at DVN Munich. Connecting with the automotive lighting community highlighted how advanced light technologies are shaping next-generation mobility. At our booth, we showcased innovations for innovative design, enhanced safety and sustainable performance — complemented by a keynote from Dr. Joerg Strauss and expert sessions by Florian Wittmann and Dr. Lufei Shen.
Read more on LinkedIn. |
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Imprint
ams-OSRAM AG
Represented by Aldo Kamper (CEO), Rainer Irle (CFO)
Tobelbader Strasse 30
A-8141 Premstaetten
Austria
Phone: +43 3136 500-0
Fax: +43 3136 525-01
Internet: https://ams-osram.com/
Contact us: https://ams-osram.com/support/customer-queries
https://ams-osram.com/imprint |
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